Method and apparatus for soldering electrical components to circ

Details Method and apparatus for soldering electrical components to circ Method and apparatus for soldering electrical components to circ

1985-05-24

1986-08-26

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 62, 228248, 228253, 427357, B23K 112, B23K 102

Patent

active

046077820

ABSTRACT:
An apparatus and method for soldering miniaturized electrical components to the surface of PC boards. A layer of solder paste is provided, into which the contact portions of electrical component leads are pressed. The component with solder paste adhering to the leads is moved to its placement station on the board and placed thereon with the leads contacting their respective pads.

REFERENCES:
patent: 2582685 (1952-01-01), Eisler
patent: 3516155 (1970-06-01), Smith
patent: 3958740 (1976-05-01), Dixon
patent: 4001464 (1977-01-01), Doutrich et al.
patent: 4311267 (1982-01-01), Lim
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4421266 (1983-12-01), Bock

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