Method and apparatus for soldering electric terminals to double-

Details Method and apparatus for soldering electric terminals to double- Method and apparatus for soldering electric terminals to double-

1976-11-03

1977-09-27

Smith, Al Lawrence

Metal fusion bonding

Process

Plural joints

228 56, 228247, 428576, B23K 102, H05K 334

Patent

active

040506215

ABSTRACT:
A method and apparatus for soldering terminals to printed circuit boards, and particularly for soldering terminals simultaneously to both sides of a printed circuit board. The apparatus consists of a connected series of preformed cones of solder which are positioned above holes in the circuit board, and through which terminals to be heated are inserted. The solder flows through the hole by capillary action, and provides electrical connection between the terminal and conduction paths on both sides of the circuit board.

REFERENCES:
patent: 2604986 (1952-07-01), Berg
patent: 3750265 (1973-08-01), Cushman
patent: 3932934 (1976-01-01), Lynch et al.

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