Method and apparatus for soldering ball grid array modules to su

Details Method and apparatus for soldering ball grid array modules to su Method and apparatus for soldering ball grid array modules to su

1996-07-17

1999-07-20

Ryan, Patrick

Metal fusion bonding

Solder form

228246, 156236, B23K 100, B23K 300, B23K 3514

Patent

active

059246227

ABSTRACT:
A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240.degree. C. and in the case of the conduction adhesive, will cure below about 240.degree. C. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.

REFERENCES:
patent: 3324014 (1967-06-01), Modjeska
patent: 4216350 (1980-08-01), Reid
patent: 4664309 (1987-05-01), Allen et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4788767 (1988-12-01), Desai et al.
patent: 4842184 (1989-06-01), Miller, Jr.
patent: 5299730 (1994-04-01), Pasch et al.
patent: 5323947 (1994-06-01), Juskey et al.
patent: 5388327 (1995-02-01), Trabucco
patent: 5718361 (1998-02-01), Braun et al.
"Solder Preform Technique for Fine Pitch Surface Mount Technology Components," IBM Technical Disclosure Bulletin, vol. 36, No. 02, Feb., 1993.
"Flip Chips on Laminates: High Volume Assembly," Slesinger, K.A., Jan. 23, 1996.

Affiliated with

Also associated with

Rating

Method and apparatus for soldering ball grid array modules to su does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for soldering ball grid array modules to su, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for soldering ball grid array modules to su will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1315120