Method and apparatus for soldering articles

Details Method and apparatus for soldering articles Method and apparatus for soldering articles

1989-07-27

1991-09-10

Seidel, Richard K.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228220, B23K 35362

Patent

active

050466585

ABSTRACT:
A technique is disclosed for achieving reduced residues on a circuit board (10) following soldering of each conductive member (18) of a component (20) to each corresponding metallized area (12) on the board. At the outset, a layer (22) of low solids solder paste is applied to the metallized areas (12) on the board. Thereafter, an acid is applied to the paste layers (22). Finally, the low solids paste is reflowed while the circuit board (10) is immersed in the inert atmosphere to bond the conductive members (18) of the component (20) to the metallized areas (12) on the circuit board (10).

REFERENCES:
patent: 2898255 (1959-08-01), Thompson
patent: 3970239 (1976-07-01), Hill
patent: 4022371 (1977-05-01), Skarvinko et al.
patent: 4600137 (1986-07-01), Comerford
patent: 4606493 (1986-08-01), Christoph et al.
patent: 4739920 (1988-04-01), Kujas
patent: 4771929 (1988-09-01), Bahr et al.
User Report, "Nitrogenius (Sic) Protective Gas Soldering System", Manufactured by SEHO, publication date believed to be approximately Oct. 1988.

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