Method and apparatus for soldering and soldering land of a print

Details Method and apparatus for soldering and soldering land of a print Method and apparatus for soldering and soldering land of a print

1998-01-28

2000-04-04

Ryan, Patrick

Metal fusion bonding

Including means to move or guide applicator

2281801, 228186, 228225, 228126, 228129, 228132, H05K 300

Patent

active

060450258

ABSTRACT:
A pair of soldering irons are fixed to a sliding plate at a predetermined interval. The soldering irons are integrally moved so as to reciprocate in a rectangular direction relative to a conveyor belt. One of the soldering irons is conveyed to a working position of the conveyor belt and the other of them is separated from the conveyor belt. While one of the soldering irons solders a circuit board, the other is cleaned. The circuit board has a slit into which a metal plate is inserted and soldered. For the slit, a soldering land constituted of a main-land and a sub-land is provided. The main-land is formed along one of longer sides of the slit. The sub-land is elongated from the main-land along a shorter side of the slit. The soldering land is not formed all around the slit so that the slit is not closed by solder when the circuit board is dip-soldered.

REFERENCES:
patent: 3887904 (1975-06-01), Krag
patent: 4851614 (1989-07-01), Duncan, Jr.

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