Method and apparatus for soldering and desoldering leadless semi

Details Method and apparatus for soldering and desoldering leadless semi Method and apparatus for soldering and desoldering leadless semi

1983-05-09

1985-11-12

Ramsey, Kenneth J.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

By fluid blast or suction

219 85R, 219373, 228264, 228242, B23K 112

Patent

active

045523002

ABSTRACT:
A method and apparatus is disclosed for soldering leadless semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal pads on a printed wiring board. The device includes a housing having a bore in which is slidably mounted a suction head. The suction head is used to raise and lower the module relative to the leaded terminals. The suction head has a passageway connected to a source of vacuum for both holding the module relative to the head as well as exhausting heated air from a source which is directed against the leaded terminals to melt same.

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