Method and apparatus for soldering a workpiece in a non-oxidizin

Details Method and apparatus for soldering a workpiece in a non-oxidizin Method and apparatus for soldering a workpiece in a non-oxidizin

1993-11-18

1995-02-14

Heinrich, Samuel M.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

By fluid blast or suction

228 37, 228 42, H05K 334

Patent

active

053887522

ABSTRACT:
A method and apparatus for soldering a workpiece in a non-oxidizing gas are achieved by comprising conveyors running in a substantially horizontal direction, for holding and moving a workpiece in the horizontal direction, a flux supplying unit for supplying flux to the workpiece, a solder bath including solder and disposed under the conveyors such that the workpiece with a parting portion parting from the top of solder flow is dipped in the top of solder flow, and jetting unit provided at an exit side of the solder bath with respect to the conveyors and connected to a non-oxidizing gas source, for jetting non-oxidizing gas from the non-oxidizing gas source into a region defined by the parting portion of the workpiece and a vicinity thereof.

REFERENCES:
patent: 4401253 (1983-08-01), O'Rourke
patent: 4451000 (1984-05-01), Stephens
patent: 4496098 (1985-01-01), Kawakatsu
patent: 4664308 (1987-05-01), Boynton
patent: 4679720 (1987-07-01), Sedrick, Jr. et al.
patent: 4995411 (1991-02-01), Lowell et al.
patent: 5044542 (1991-09-01), Deambrosio
patent: 5048746 (1991-09-01), Elliott et al.
patent: 5121874 (1992-06-01), Deambrosio et al.
patent: 5203489 (1993-04-01), Gileta et al.
patent: 5240169 (1993-08-01), Gileta

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