Metal fusion bonding – Process – With shaping
Patent
1994-10-21
1996-03-12
Heinrich, Samuel M.
Metal fusion bonding
Process
With shaping
2281791, 228253, 228259, 29860, H05K 334
Patent
active
054979366
ABSTRACT:
A method is provided for soldering a coil winding to a terminal pin. A specific quantity of solder is applied onto the terminal pin, the terminal pin having a winding end wrapped therearound. The solder, for example, can be applied by immersing the pin end into a solder bath having a temperature only slightly above the melting point of the solder. Subsequently, the solder is melted with a welding torch under a protective atmosphere only at a power and time required to achieve a soft-soldering temperature. As a result thereof, a soldering free of fluxing agent and without the high thermal stress of a welding is possible. Other embodiments include placing a ring of solder onto the terminal prior to heating. Also, a predetermined length of solder wire can be brought into contact with the terminal pin prior to heating. The invention provides a guide tube device for such a purpose.
REFERENCES:
patent: 3834015 (1974-09-01), DiRenzo
patent: 4039801 (1977-08-01), Foerster et al.
patent: 4471160 (1984-09-01), Arthur
Patent Abstracts of Japan, vol. 10, No. 297 (E-444) (2353), Oct. 9, 1986.
Patent Abstracts of Japan, vol. 10, No. 379 (E-465) (2436), Dec. 18, 1986.
Hendel Horst
Vojta Erich
Heinrich Samuel M.
Siemens Aktiengesellschaft
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