Method and apparatus for solder sphere placement using an air kn

Details Method and apparatus for solder sphere placement using an air kn Method and apparatus for solder sphere placement using an air kn

1994-02-07

1995-07-11

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228254, 118213, 427282, B23K 100, B23K 308, H05K 334

Patent

active

054313325

ABSTRACT:
A station (10) in a manufacturing line (12) for the accurate placement of solder balls (30) on a ball grid array package and for the removal of excess solder balls comprises a substrate (4) having an array of solder pads (7), and an adhesion layer (8) on the solder pads. The station further comprises a stencil (16) placed on top of the substrate and having a height between 1/4 times the diameter of one of the solder balls and 5/4 times the diameter of one of the balls, the stencil having an array of apertures (18) corresponding to the array of solder pads and substantially exposing each of the solder pads of the array, a pallet (2) for holding and transporting the substrate to the stencil and further along the manufacturing line, a dispenser (26) for pouring solder balls in bulk over the stencil, a vibration device (20) coupled to the station for urging the solder balls into the apertures of the stencil and onto the adhesion layer above the solder pads, and a moving directed column of air (24) across the surface of the stencil to remove excess solder balls from the stencil.

REFERENCES:
patent: 4462534 (1984-07-01), Bitaillou et al.
patent: 4830264 (1989-05-01), Bitallou et al.
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 5024372 (1991-06-01), Altman et al.
patent: 5159171 (1992-10-01), Cook et al.
patent: 5205896 (1993-04-01), Brown et al.
patent: 5255839 (1993-10-01), da Costa Alves et al.

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