Method and apparatus for solder plating an object

Details Method and apparatus for solder plating an object Method and apparatus for solder plating an object

1989-07-06

1990-06-12

Godici, Nicholas P.

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

228215, 228254, 228256, 228 33, 228 39, 228 561, 228 562, 228 40, 118505, 118406, 118429, 427431, 427433, B23K 108, H05K 334

Patent

active

049325850

ABSTRACT:
A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable material having an inclined upper surface is placed in a molten solder bath. The electronic device, with the leads to be solder plated exposed, is lowered horizontally in the solder bath and is pulled out horizontally. A large quantity of solder adhering on the inclined plate pulls solder adhering on the leads sequentially along an inclined surface of the plate to obtain uniform thickness of solder plating on the leads without causing bridging.

REFERENCES:
patent: 3604609 (1971-09-01), Walls
patent: 3828419 (1974-08-01), Wanner
patent: 3989180 (1976-11-01), Tardoskegyi
patent: 4011980 (1977-03-01), Dvorak et al.
patent: 4162034 (1979-07-01), Pavlas
patent: 4315590 (1982-02-01), Kondo
patent: 4506820 (1985-03-01), Brucker
patent: 4659002 (1987-04-01), Wallgren et al.

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