Method and apparatus for solder deposition

Metal fusion bonding – Miscellaneous

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269903, 228 443, B23K 100

Patent

active

049094297

ABSTRACT:
A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored. The apparatus is a pressure fixture usable for vapor phase solder deposition of a pwb and comprises a first and a second member which are removably fastened together in an opposed relationship with a pwb is disposed between the first and the second members.

REFERENCES:
patent: 1385088 (1921-07-01), Mellor
patent: 1796764 (1931-03-01), Perry
patent: 2612794 (1952-10-01), Pleasance
patent: 3262694 (1966-07-01), O'Farrell
patent: 3759436 (1973-09-01), Foster
patent: 4448406 (1984-05-01), Hallberg
patent: 4669416 (1987-06-01), Delgado
patent: 4706602 (1987-11-01), Polacek
patent: 4730819 (1988-03-01), Hirschhorn

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