Metal fusion bonding – Process – Plural joints
Patent
1987-03-30
1989-01-31
Rowan, Kurt
Metal fusion bonding
Process
Plural joints
228 563, B23K 3102
Patent
active
048010693
ABSTRACT:
A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored. The apparatus is a pressure fixture usable for vapor phase solder deposition of a pwb and comprises a first and a second member which are removably fastened together in an opposed relationship with a pwb is disposed between the first and the second members.
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"Phase-Four" Production Systems for Vapor Phase Soldering-HTC, Pond Lane, Concord, MA 01742-1983/Pub. 37832.
Ankrom Michael J.
Rew James A.
Rowan Kurt
Sutcliff W. G.
Westinghouse Electric Corp.
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