Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1990-05-16
1991-10-15
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
118246, 118248, 118227, C23C 2600
Patent
active
050573373
ABSTRACT:
A pair of solder coating rolls are disposed horizontally adjacent one another for rotation about parallel horizontal axes, and are spaced apart to define a narrow vertically-oriented nip therebetween for accommodating a lead frame therein. Lower parts of the rolls contact a solder bath, and counter rotation of the rolls carries the solder upwardly on the periphery of the rolls to create a small pool of solder at the upper end of the nip. The lead frame is driven vertically upwardly through the nip, which nip has a minimal dimension greater than the lead frame thickness. The lead frame is driven vertically upwardly at a linear speed which is different from, and preferably slower than, the peripheral speed fo the solder coating rolls. This enables preheating of the surface of the lead frame due to its longer exposure to and contact with the hot solder which coats the periphery of the rolls, thereby improving the wetability of the lead frame surface. At the same time, this upward movement of the lead frame through the nip and through the pool of liquid solder permits a solder coating of high quality and uniformity to be applied to the lead frame.
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Kojima Naokatsu
Makino Shinichi
Beck Shrive
Dang Vi Duong
Fuji Seiki Machine Works Ltd.
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