Method and apparatus for solder bumping of printed circuit board

Details Method and apparatus for solder bumping of printed circuit board Method and apparatus for solder bumping of printed circuit board

1987-02-20

1988-06-21

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

427359, 228207, B23K 3102

Patent

active

047520272

ABSTRACT:
A method and apparatus for preparing printed circuit boards having flattened solder bumps for the mounting of surface mount components is provided. Using well-known techniques, solder paste is screen-printed onto printed circuit boards and reflowed and cleaned to form discrete solder bumps. Using roller machines, the peaks of the solder bumps are flattened and adhesive solder flux is applied to the flattened tops of the solder bumps. The adhesive solder flux holds the surface mount components in position after placement and during vapor phase reflow.

REFERENCES:
patent: 3621564 (1971-11-01), Shigezo-Tanaka et al.
patent: 3713575 (1973-01-01), Cushman
patent: 3871015 (1975-03-01), Din et al.
patent: 4503096 (1985-03-01), Specht
patent: 4558812 (1985-12-01), Bailey et al.
patent: 4582975 (1986-04-01), Daughton
patent: 4661192 (1987-04-01), McShane
IBM Technical Disclosure, vol. 24, No. 12, May 1982.

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