Abrading – Precision device or process - or with condition responsive... – Computer controlled
Patent
1996-03-21
1997-09-16
Morgan, Eileen
Abrading
Precision device or process - or with condition responsive...
Computer controlled
451 8, 451 41, 451 53, 451 69, 425 1301, 425 1302, B28D 104
Patent
active
056674236
ABSTRACT:
Disclosed are an improved method and apparatus for slicing a workpiece such as a semiconductor ingot, in which coolant nozzles are disposed near the cutting edge of an annular blade, air nozzles are respectively equipped near the both side surfaces, the air nozzles are connected to a compressed air supply source via pressure regulators and electromagnetic valves, a deflection detector is located in the vicinity of one of the side surfaces, which detector is connected to the air nozzles via a computer and the pressure regulators, wherein, in the course of slicing, for example, if an actual deflection has been detected toward one of the side surfaces, the compressed air is blown from an adjacent air nozzle to the one of the side surfaces and the secondary pressure of the pressure regulator connecting to the adjacent air nozzle is regulated higher or lower, as the blade is deflected larger or smaller. In such a manner, deflection of the blade is minimized to decrease a warpage of a sliced wafer obtained by the annular saw blade method and apparatus.
REFERENCES:
patent: 4844047 (1989-07-01), Brehm et al.
IBM Technical Disclosure Bulletin vol. 25, No. 5, Oct. 1982.
Morgan Eileen
Shin-Etsu Handotai & Co., Ltd.
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