Stone working – Sawing – Rotary
Patent
1993-07-08
1996-06-11
Lavinder, Jack W.
Stone working
Sawing
Rotary
451180, B28D 104
Patent
active
055246044
ABSTRACT:
A method and apparatus for slicing semiconductor wafers. An inner peripheral cutting edge has a doughnut-shaped blade with electro-deposited diamond grains. The blade is attached to a moving trestle. The moving trestle moves along rails located on both sides of the inner peripheral cutting edge and is driven by instruction signals from a control section. A workpiece is placed within the inner peripheral cutting edge and rotated about the axis thereof by a motor. The motor is mounted on a beam member and is driven by instruction signals from the control section. With this arrangement, the inner peripheral cutting edge is rotated in the direction of arrow A. Then, the moving trestle moves in the direction of arrow B by the control section and the workpiece is pressed against a grindstone on the inner peripheral cutting edge cutting the workpiece by a predetermined value. Thereafter, the moving trestle is stopped by the control section and the workpiece is rotated about the axis thereof by driving the motor to cut the remainder part of the workpiece.
REFERENCES:
patent: 3025738 (1962-03-01), Winkler
patent: 3039235 (1962-06-01), Heinrich
patent: 3232009 (1966-02-01), Awender
patent: 4084354 (1978-04-01), Grandia et al.
patent: 4127969 (1978-12-01), Hoshi et al.
patent: 4712535 (1987-12-01), Fujisawa
Lavinder Jack W.
Tokyo Seimitsu Co. Ltd.
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