Method and apparatus for singulating semiconductor devices

Details Method and apparatus for singulating semiconductor devices Method and apparatus for singulating semiconductor devices

1998-07-27

2000-11-21

Niebling, John F.

Semiconductor device manufacturing: process

Semiconductor substrate dicing

83 25, 83 35, 83452, H01L 21301

Patent

active

061502405

ABSTRACT:
Method and apparatus for singulating semiconductor devices (21) is provided. This approach eliminates the need for an adhesive tape. A fixture (10) is provided to hold the joined semiconductor devices. The fixture has grooves (14 and 18) to accommodate a saw blade (35). The saw makes a cut in two directions thereby separating or singulating the semiconductor devices. Bars (24) are placed across the semiconductor devices when sawing in the second direction to hold the semiconductor devices in the holding fixture. A pick and place machine can then be used to remove the singulated semiconductor devices from the holding fixture.

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