Method and apparatus for side-type heat dissipation

Details Method and apparatus for side-type heat dissipation Method and apparatus for side-type heat dissipation

2007-02-20

2007-02-20

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C174S016300, C257S722000

Reexamination Certificate

active

10952811

ABSTRACT:
The present invention is a method and an apparatus for side-type heat dissipation. According to the present invention, a heat dissipation unit is deposed on a CPU to absorb the heat it generates; a cover is covered on the unit, where two openings are at two opposite ends and one of the openings has an inclined plane as well as a fan, and one of the openings is corresponding to a fan on the computer case; and an air flow is guided by a fan to the heat dissipation unit and is directed to a fan of a power supplier to be blown out of the computer case. By doing so, no thermal cycling will occur in the computer case and better heat-dissipation efficiency can be obtained.

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