Method and apparatus for shielding a printed circuit board

Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition

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361424, 295921, H05K 900

Patent

active

050066676

ABSTRACT:
The invention relates to a method and a shielding housing for shielding a printed circuit board, or a part of it, from disturbances caused by electromagnetic interference (EMI). In the method, during the manufacturing phase of the printed circuit board there are cut in the board slots (U) through the printed circuit board (pc), the length of the slots being L. The first part (2) of the housing is soldered to the printed circuit board (pc) in such a way that it approximately interconnects the ends of the cut slots (U). This first part constitutes one side wall of the shielding housing. The second part (1) of the shielding housing is made up of a cover (5) and three side walls, in which there is formed an inside groove having a height which corresponds to the thickness of the printed circuit board. After the soldering of the components, this second part (1) is slipped on the printed circuit board so that the printed circuit part between the slots (U) cut in the printed circuit board will be left on the inside of the side walls (7, 7',7") of the second part (1) and will bear on the inside grooves of the inner walls. The first part (2) and the second part (1) have locking means (3, 4) which lock the parts detachably to each other.

REFERENCES:
patent: 4631641 (1986-12-01), Brombal et al.
patent: 4713633 (1987-12-01), Saito et al.
patent: 4890199 (1989-12-01), Beutler
patent: 4903170 (1990-02-01), Finney et al.
patent: 4912604 (1990-03-01), Vaisanen

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