Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-01-04
2005-01-04
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S842000, C029S843000, C029S876000, C029S878000, C029S879000
Reexamination Certificate
active
06836962
ABSTRACT:
Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.
REFERENCES:
patent: 1211559 (1917-01-01), Dun Lany
patent: 2429222 (1947-10-01), Ehrhardt et al.
patent: 3599093 (1971-08-01), Oates
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4618821 (1986-10-01), Lenz
patent: 4674671 (1987-06-01), Fister et al.
patent: 4732313 (1988-03-01), Kobayashi et al.
patent: 4827611 (1989-05-01), Pai et al.
patent: 4860433 (1989-08-01), Miura
patent: 5037023 (1991-08-01), Akiyama et al.
patent: 5095187 (1992-03-01), Gliga
patent: 5195237 (1993-03-01), Cray et al.
patent: 5294039 (1994-03-01), Pai et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5513430 (1996-05-01), Yanof et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5720098 (1998-02-01), Kister
patent: 5944537 (1999-08-01), Smith et al.
patent: 6049976 (2000-04-01), Khandros
patent: 63-56924 (1988-03-01), None
patent: 02-34949 (1990-02-01), None
patent: 04-240570 (1992-08-01), None
patent: WO 9514314 (1995-05-01), None
patent: WO 9637331 (1996-11-01), None
patent: WO 9637333 (1996-11-01), None
patent: WO 9637931 (1996-11-01), None
“Enhanced Thermosonic Wire-Bonding Technique,” Research Disclosure, Sep. 1989, No. 30508 (Kenneth Mason Publications Ltd., England).
“Metal Chip Component For Wirebonding Pad,” IBM Technical Disclosure Bulletin, vol. 34, No. 5 (Oct. 1991), p. 180.
Best et al., “Flexible Probe,” IBM Technical Disclosure Bulletin, vol. 15, No. 11 (Apr. 1973), pp. 3428-3429.
Weast, “Handbook of Chemistry and Physics,” CRC Press (Ohio 1975-76), pp. D-171 and D-172.
Dozier Thomas H.
Grube Gary W.
Khandros Igor Y.
Mathieu Gaetan L.
Buraston Ken
FormFactor Inc.
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