Stone working – Sawing – Rotary
Patent
1986-06-04
1987-12-15
Whitehead, Harold D.
Stone working
Sawing
Rotary
82 702, 82 46, 51 73R, B28D 104
Patent
active
047125357
ABSTRACT:
A method and an apparatus for severing a workpiece into wafer slices, wherein the inclined surface to be cut can be processed to remove protrusions or impressions which occur around the cut surface. The workpiece has a front end portion which is cut by a cutting tool and a rear end portion which is inclined with respect to the central position of the surface of the workpiece to be cut. This central position is the center of rotation about which the workpiece is rotated to generate a cone shape. When the workpiece is fed axially for cutting to obtain wafers, the central position of the workpiece surface to be cut is held at a constant position so that the workpiece can be cut continuously at a constant angle of inclination. The front end portion of the wafer being cut is rotated while being pulled in a direction from the workpiece until the completion of the severing operation. Then, when the severing has been completed, the process wafer is rotated and pressed toward the workpiece so that protrusions, impressions or grooves can be removed from around the central portion of the cut end portion.
REFERENCES:
patent: 3039235 (1962-06-01), Heinrich
patent: 4084354 (1978-04-01), Grandia
patent: 4227348 (1980-10-01), Demers
patent: 4420909 (1983-12-01), Steere
patent: 4445494 (1984-05-01), Schiele
patent: 4530452 (1985-07-01), Balyasny
"Improved Slicing and Orientation Technique for I.D. Saving", Industrial Diamond Review, Nov. 1977, pp. 385-387.
Hitachi , Ltd.
Whitehead Harold D.
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