Method and apparatus for sequential plasma treatment

Details Method and apparatus for sequential plasma treatment Method and apparatus for sequential plasma treatment

2002-04-24

2009-11-17

Padgett, Marianne L (Department: 1792)

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

C427S569000, C427S570000, C427S536000, C216S071000, C118S7230ER, C118S7230MP

Reexamination Certificate

active

07618686

ABSTRACT:
An apparatus for plasma treatment of a non-conductive hollow substrate, including a plurality of ionization energy sources disposed adjacent to each other all along the part of the substrate to be treated. The apparatus also includes a processor to sequentially power the plurality of ionization energy sources from a radio frequency power source. Each ionization energy source includes two parts sandwiching the substrate. The ionization energy sources can be capacitively or inductively coupled plasma sources.

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Translation of JP 11-256331 (see above).
Translation of JP 10-226884 (see above).

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