Method and apparatus for separating chips

Details Method and apparatus for separating chips Method and apparatus for separating chips

1990-05-18

1991-05-28

Peters, Jr., Joseph F.

Material or article handling

Apparatus for moving intersupporting articles into, within,...

Stack forming apparatus

4147448, 125 1301, 51283R, B66C 2300

Patent

active

050189387

ABSTRACT:
An apparatus (18) for separating an individual chip (14) from a semiconductor wafer (10) adhered to a diaphragm (16) comprises a "C"-shaped arm (26) having parallel, spaced-apart upper and lower arm portions (28) and (29). The upper arm portion (28) is provided with a yoke (34) at its free end for engaging a robot (42) which carries a pickup tool (46). The free end of the lower arm portion (29) mounts a die ejector (38) lying directly beneath the pickup tool (46) when the robot (42) engages the upper arm portion (28). Once the die ejector (38) is positioned below, and the pickup tool (46) is positioned above, a particular chip (14), actuation of the die ejector causes the chip to be separated and urged upwardly for engagement by the pickup tool. In this way, the need to separately position the die ejector (38) and the pickup tool (46) is obviated.

REFERENCES:
patent: 3377653 (1968-04-01), Buonaiuto
patent: 3893644 (1975-07-01), Drazick
patent: 4253280 (1981-03-01), Du Bois et al.
patent: 4407262 (1983-10-01), Wirz et al.
patent: 4526646 (1985-07-01), Suzuki et al.
patent: 4556362 (1985-12-01), Bahnck et al.
patent: 4852304 (1989-08-01), Honda et al.
patent: 4944119 (1990-07-01), Gill, Jr. et al.
Sales Literature, "Flexible Work Station," AT&T, Jan. 1989.

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