Cutting – Other than completely through work thickness or through work... – Splitting
Patent
1995-12-26
1997-08-19
Rachuba, Maurina T.
Cutting
Other than completely through work thickness or through work...
Splitting
83871, 83 16, B26D 102
Patent
active
056576790
ABSTRACT:
In "laminated object manufacturing" in which a prototype of an object is constructed by layering pieces of paper which are individually cut by a laser beam controlled by a 3-D computer design, method and apparatus are disclosed for severing the completed "build" from its base by a wire which is constricted to cut through a low-density layer between the base and the build.
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Hronas John J.
Niemiec Marcin
Krayer William L.
Multi-Products, Inc.
Rachuba Maurina T.
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