Photocopying – Projection printing and copying cameras – Distortion introducing or rectifying
Reexamination Certificate
2005-06-14
2005-06-14
Nguyen, Henry Hung (Department: 2851)
Photocopying
Projection printing and copying cameras
Distortion introducing or rectifying
C355S053000
Reexamination Certificate
active
06906780
ABSTRACT:
A reticle consisting of a 2-dimensional array of standard overlay targets is exposed several times onto a photoresist coated silicon wafer using a photolithographic scanner. Next, the overlay targets are measured for placement error using a conventional overlay metrology tool. The resulting overlay error data is then fed into a software program that generates the lens contribution to the intra-field error map for the photolithographic projection scanning system.
REFERENCES:
patent: 4861148 (1989-08-01), Santo et al.
patent: 5285236 (1994-02-01), Jain
patent: 5402224 (1995-03-01), Hirukawa et al.
patent: 5438413 (1995-08-01), Mazor et al.
patent: 5615006 (1997-03-01), Hirukawa et al.
patent: 5757507 (1998-05-01), Ausschnitt et al.
patent: 5877861 (1999-03-01), Ausschnitt et al.
patent: 5894350 (1999-04-01), Hsieh et al.
patent: 6079256 (2000-06-01), Bareket
patent: 6143621 (2000-11-01), Tzeng et al.
patent: 6153886 (2000-11-01), Hagiwara et al.
patent: 6204912 (2001-03-01), Tsuchiya et al.
patent: 6259525 (2001-07-01), David
patent: 6356343 (2002-03-01), Shiraishi et al.
patent: 6563573 (2003-05-01), Morohoshi et al.
patent: 6573986 (2003-06-01), Smith et al.
patent: 2002/0071112 (2002-06-01), Smith et al.
Lin, B.J., “The Attenuated Phase-Shifting Mask”, Solid State Technology, Special Series/Advanced Lithography, 35(1):43-47, (Jan., 1992).
Armitage et al., “Analysis of Overlay Distortion Patterns”,SPIE, 921:207-221 (1988).
Bjorkholm et al., “Reduction Imaging at 14 nm Using Multilayer-Coated Optics: Printing of Features Smaller than 0.1 μm”,J. Vac. Sci. Technol. B., 8(6):1509-1543 (1990).
Bruning et al., “Optical Lithography—Thirty Years and Three Orders of Magnitude”,SPIE, 3051:14-27 (1997).
Brunner, T.A., “Impact of Lens Aberrations on Optical Lithography”,IBM J. Res. and Devel.: Optical Lithography, 41(1-2):57-67 (1997). Reprint submitted, pp. 1-27.
Cote et al., “Micrascan™ III-Performance of a Third Generation, Catadioptric Step and Scan Lithographic Tool”,SPIE, 3051:806-816 (1997).
DeJule, R., “Mix and Match: A Necessary Choice”,Semiconductor International, 23(2):66-76 (2000).
Dooly et al., “Stepper Matching for Optimum Line Performance”,SPIE, 3051:426-432 (1997).
Goodwin et al., “Characterizing Overlay Registration of Concentric 5X and 1X Stepper Exposure Fields Using Interfield Data”,SPIE, 3050:407-417 (1997).
Handbook of Microlithography, Micromachining and Microfabrication, Book: vol. 1, “Microlithography”, Rai-Choudhury, P. (Ed.)., SPIE Optical Engineering Press, SPIE, Bellingham, Washington, pp. 417-418 (1997).
Hasan et al., “Automated Electrical Measurements of Registration Errors in Step-and-Repeat Optical Lithography Systems”,IEEE Transactions on Electron Devices, ED27(12):2304-2312 (1980).
Kemp et al., “A ‘Golden Standard’ Wafer Design for Optical Stepper Characterization”,SPIE, 1464:260-266 (1991).
KLA 5105, “Linewidth and Misregistration System”, KLA 5105 Product Specification,KLA Instruments Corporation, 2 pages (1995).
KLA 5200, “Value-added Overlay Metrology for Advanced Lithography”, KLA 5200 Product Specifications,KLA Instruments Corporation, 2 pages, (1996).
Kodama et al., “Measuring System XY-5i”,SPIE, 2439:144-155 (1995).
Leica LMS IPRO, “Fully Automated Mask and Wafer Metrology System”,Leica, pamphlet pp. 1-5.
MacMillen et al., “Analysis of Image Field Placement Deviations of a 5X Microlithographic Reduction Lens”,SPIE, 334:78-89 (1982).
Martin et al., “Measuring Fab Overlay Programs”,SPIE, 3677:64-71 (1999).
McFadden et al., “A Computer Aided Engineering Workstation for Registration Control”,SPIE, 1087:255-266 (1989).
Mulkens et al., “ArF Step and Scan Exposure System for 0.15 μm Technology Node?”,SPIE, 3679:506-521 (1999).
Newnam et al., “Development of XUV Projection Lithograph at 60-80 nm”,SPIE, 1671:419-436 (1992).
Numerical Recipes, “The Art of Scientific Computing”, Press et al., (Eds.), Cambridge University Press, New York, pp. 52-64 (1990).
Pellegrini, J.C., “Comparisons of Six Different Intrafield Control Paradigms in an Advanced Mix-and-Match Environment”,SPIE, 3050:398-406 (1997).
Pellegrini et al., “Super Sparse Overlay Sampling Plans: An Evaluation of Methods and Algorithms for Optimizing Overlay Quality Control and Metrology Tool Throughput”,SPIE, 3677:72-82 (1999).
Preil et al., “A New Approach to Correlating Overlay and Yield”,SPIE, 3677:208-216 (1999).
Quaestor Q7, “Fully Automated Optical Metrology System for Advanced IC Production”, Quaestor Q7 Product Specification,BIO-RAD, 2 pages.
Raugh, M.R., “Error Estimation for Lattice Methods of State Self-Calibration”,SPIE, 3050:614-625 (1997).
Sullivan, N.T., “Semiconductor Pattern Overlay”,SPIE Critical Reviews of Optical Science and Technology, CR52:160-188 (1994).
Takac et al., “Self-Calibration in Two-Dimensions: The Experiment”,SPIE, 2725:130-146 (1996).
van den Brink et al., “Direct-Referencing Automatic Two-Points Reticle-to-Wafer Alignment Using a Projection Column Servo System”,SPIE, 633:60-71 (1986).
van den Brink et al., “Matching Management of Multiple Wafer Steppers Using a Stable Standard and a Matching Simulator”,SPIE, 1087:218-232 (1989).
van den Brink et al., “Matching of Multiple Wafer Steppers for 0.35 μm Lithography Using Advanced Optimization Schemes”,SPIE, 1926:188-207 (1993).
van den Brink et al., “Matching Performance for Multiple Wafer Steppers Using an Advanced Metrology Procedure”,SPIE, 921:180-197 (1988).
van den Brink et al., “New 0.54 Aperture i-Line Wafer Stepper with Field by Field Leveling Combined with Global Alignment”,SPIE, 1463:709-724 (1991).
van Schoot et al., “0.7 NA DUV Step & Scan System for 150nm Imaging with Improved Overlay”,SPIE, 3679:448-463 (1999).
Yost et al., “Lens Matching and Distortion Testing in a Multi-Stepper, Sub-Micron Environment”,SPIE, 1087:233-244 (1989).
Zavecz et al., “Life Beyond Mix-and-Match: Controlling Sub-0.18 μm Overlay Errors”Semiconductor International, 23(8):205,206,208,210,212 and 214 (2000).
Zavecz, T.E., “Machine Models and Registration”,SPIE Critical Reviews of Optical Science and Technology, CR52:134-159 (1994).
Litel Instruments
Nguyen Henry Hung
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