Method and apparatus for selective soldering

Details Method and apparatus for selective soldering Method and apparatus for selective soldering

1992-07-29

1993-08-24

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 31, 228223, 228260, B23K 3102

Patent

active

052381757

ABSTRACT:
Disclosed is a method and apparatus for applying flux and solder in order to attach connectors to printed circuit boards (PCBs). Flux is applied to the connector tails and the PCB pads by means of a roller mounted above a flux reservoir. The piece parts are then exposed to a solder wave such that the solder sticks only to the selected area to which the flux was applied.

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patent: 5080722 (1992-01-01), Englert et al.
patent: 5148961 (1992-09-01), Humbert et al.
L. A. Guth and J. R. Morris, "No-Clean Soldering Processes," AT&T Technical Journal, pp. 37-44 (Mar./Apr. 1992).

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