Method and apparatus for selective electroplating using soluble

Details Method and apparatus for selective electroplating using soluble Method and apparatus for selective electroplating using soluble

1993-12-03

1995-04-25

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Utilizing brush or absorbent applicator

204224R, 204225, 204237, 204269, 204271, 204275, 204274, 205133, 205148, C25D 506, C25D 1700, C25D 1714, C25D 2102

Patent

active

054095930

ABSTRACT:
A device is provided for brush electroplating a surface of a workpiece. The device includes an anode generally composed of a metal to be electroplated on the surface of the workpiece. The anode is selectively retained within a cavity formed in a lower surface of a carrier piece composed of a generally electrical non-conductive material. The lower surface of the carrier piece is shaped to conform to at least a portion of the surface of the workpiece. An absorbent material extends over the lower surface of the carrier piece to form a brush. The cover material and lower surface of the anode are spaced from each other to form a chamber. The device also includes an assembly, fluidly connected to the space between the anode and absorbent material, to inject a flow of the electrolytic fluid into the chamber.

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