Method and apparatus for selective burnout trimming of integrate

Metal working – Method of mechanical manufacture – Assembling or joining

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Details

29584, 29586, 338195, 29577, B01J 1700

Patent

active

039303047

ABSTRACT:
Supplementary metallized connection parts short-circuiting or connecting incremental sub-components of one or more circuit elements of an integrated circuit are laid down on the semiconductor slice at the same time as the usual metallized connection pattern is made. The components associated with the incremental sub-components are measured to determine the program of adjustment and selective burnout of the supplementary connections. The selective burnout is carried out by applying a sequence of pulses to the segments to be burned out under monitoring by a measuring circuit, which blocks the delivery of further pulses, either immediately or after one or a few more pulses, when the measuring circuit detects the opening of the connection. The process is preferably carried out on integrated circuits before the semiconductor slice on which they are made is separated into individual circuit units. The pulses are applied in sequences in which individual pulses or series of pulses have increasing amplitude and/or pulse duration and/or pulse frequency.

REFERENCES:
patent: 2926418 (1960-03-01), Zuleeg
patent: 3500148 (1970-03-01), Gunther
patent: 3742592 (1973-07-01), Rizzi

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