Method and apparatus for sealing flex circuits having heat...

Details Method and apparatus for sealing flex circuits having heat... Method and apparatus for sealing flex circuits having heat...

2006-10-31

2006-10-31

Aftergut, Jeff H. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S308400, C349S190000

Reexamination Certificate

active

07128801

ABSTRACT:
A method and apparatus is disclosed for affixing a cover layer formed of liquid crystal polymer to a flex circuit consisting of circuit elements mounted to a liquid crystal polymer substrate in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants and to provide thermal protection of temperature sensitive circuit elements within the flex circuit during the encapsulation process.

REFERENCES:
patent: 5827999 (1998-10-01), McMillan et al.
patent: 5993593 (1999-11-01), Swartz et al.
patent: 6320257 (2001-11-01), Jayaraj et al.
patent: 2002/0189755 (2002-12-01), Calmidi et al.
patent: 2003/0207048 (2003-11-01), St. Lawrence et al.
patent: 2004/0010910 (2004-01-01), Farrell et al.
patent: 2004/0012083 (2004-01-01), Farrell et al.

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