Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1998-09-18
2000-09-05
Crispino, Richard
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156285, 156351, 156367, 156572, B32B 3126, B65C 6900
Patent
active
061137162
ABSTRACT:
An automated apparatus and method for sealing an edge region of a planar material ply includes a central controller and at least one platform. The automated apparatus and method further employs a mechanism for picking a single planar material ply in addition to a mechanism for moving the single planar material ply to the platform. The automated apparatus and method includes a sealing device which seals the edge region of the planar material ply where the sealing device provides a fluid to a predetermined focused region within the edge region. The fluid substantially shrinks and melts strands in the focused region of the planar material ply.
REFERENCES:
patent: 4601249 (1986-07-01), Frye
patent: 4685408 (1987-08-01), Frye
patent: 4888229 (1989-12-01), Paley et al.
patent: 5018462 (1991-05-01), Brocklehurst
patent: 5069735 (1991-12-01), Reynolds
patent: 5466326 (1995-11-01), Cherney
patent: 5605731 (1997-02-01), Pubill
patent: 5619942 (1997-04-01), Stewart et al.
patent: 5645002 (1997-07-01), Brocklehurst
patent: 5769999 (1998-06-01), Anderson et al.
patent: 5928462 (1999-07-01), Stewart et al.
patent: 5967505 (1999-10-01), Lin et al.
Beasock Robert J.
Russo John R.
Schramayr Ernst
Crispino Richard
Jet Sew Technologies Inc.
Koch, III George R.
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