Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-07
2006-11-07
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S698000, C257S714000, C257S717000
Reexamination Certificate
active
07133286
ABSTRACT:
A method and apparatus is disclosed for liquid cooling an electronic device without wetting underside hardware of the electronic device and a substrate to which it is attached. In an exemplary embodiment, an electronic module substrate assembly includes a substrate, an electronic device electrically connected to the substrate, and an elastomer barrier. The barrier includes a cutout configured to sealably affix to chip edges defining the electronic device. The cutout provides fluid communication to a back surface of the electronic device exposed through the cutout while the barrier seals the substrate from such fluid communication.
REFERENCES:
patent: 3616533 (1971-11-01), Heap et al.
patent: 4029999 (1977-06-01), Neumann et al.
patent: 4081825 (1978-03-01), Koopman et al.
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 5000256 (1991-03-01), Tousignant
patent: 5001548 (1991-03-01), Iversen
patent: 5006924 (1991-04-01), Frankeny et al.
patent: 5014161 (1991-05-01), Lee et al.
patent: 5138523 (1992-08-01), Benck et al.
patent: 5175613 (1992-12-01), Barker et al.
patent: 5300810 (1994-04-01), Eden
patent: 5315480 (1994-05-01), Samarov et al.
patent: 5426565 (1995-06-01), Anderson
patent: 5528466 (1996-06-01), Lim et al.
patent: 5608610 (1997-03-01), Brzezinski
patent: 5648890 (1997-07-01), Loo et al.
patent: 5720338 (1998-02-01), Larson et al.
patent: 5819402 (1998-10-01), Edwards et al.
patent: 5880524 (1999-03-01), Xie
patent: 6028351 (2000-02-01), Klonis et al.
patent: 6351384 (2002-02-01), Daikoku et al.
patent: 6587345 (2003-07-01), Chu et al.
patent: 6627997 (2003-09-01), Eguchi et al.
patent: 6853071 (2005-02-01), Yoshikawa
patent: 6972958 (2005-12-01), Mayer
patent: 7030485 (2006-04-01), Houle et al.
Universal Option Card Heatsink, IBM Technical Disclosure Bulletin Aug. 1993, pp. 411-412.
Schmidt Roger R.
Singh Prabjit
LandOfFree
Method and apparatus for sealing a liquid cooled electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for sealing a liquid cooled electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for sealing a liquid cooled electronic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3634565