Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-04-05
2011-04-05
Nguyen, Khanh (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S272200, C156S272800, C156S285000, C156S379600, C156S497000
Reexamination Certificate
active
07918954
ABSTRACT:
An apparatus for sealing a substrate assembly by applying a force to the assembly while simultaneously exposing the substrate assembly, and in particular a sealing material disposed between two substrates of the substrate assembly, to an irradiating beam of electromagnetic energy. The beam heats, cures and/or melts the sealing material, depending upon the sealing material to form the seal. The force is applied by directing a flow of fluid against the substrate assembly, and beneficially improves contact between the substrates of the substrate assembly and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates.
REFERENCES:
patent: 6998776 (2006-02-01), Aitken et al.
patent: 2003/0020181 (2003-01-01), Yamada
patent: 2005/0217319 (2005-10-01), Yoshizawa
patent: 2007/0176551 (2007-08-01), Kwak
Amsden Jeffrey Michael
Bernas James Joseph
Costello, III John Joseph
Gentile Margaret Helen
Stocker Mark Andrew
Able Kevin M.
Corning Incorporated
Gross Carson
Nguyen Khanh
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