Method and apparatus for scrubbing the bond pads of an integrate

Details Method and apparatus for scrubbing the bond pads of an integrate Method and apparatus for scrubbing the bond pads of an integrate

1997-11-24

2000-10-10

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

G01R 106

Patent

active

061305456

ABSTRACT:
An improved method and apparatus for electrically coupling the bond pads of an integrated circuit to a tester. One embodiment the invention includes a probe card having a plurality of test probes and a means for placing the test probes in intimate contact with a corresponding set of bond pads located along the surface of an integrated circuit. Electrical contact is achieved between the test probes and bond pads by inducing a small and rapid cyclic movement between the test probes and bond pads such that the test probes pierce a dielectric layer on the surface of the bond pads. In one embodiment, the cyclic movement between the test probes and bond pads is achieved by the use of a piezoelectric actuator.

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patent: 5436571 (1995-07-01), Karasawa
patent: 5563524 (1996-10-01), Crumly

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