Method and apparatus for scrubbing the bond pads of an integrate

Details Method and apparatus for scrubbing the bond pads of an integrate Method and apparatus for scrubbing the bond pads of an integrate

1997-06-13

1999-06-01

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 104

Patent

active

059091215

ABSTRACT:
A method and apparatus for electrically coupling the bond pads of an integrated circuit to a tester using a probe card having a biasing element supporting a plurality of tests probes. In one embodiment, the method includes the steps of placing the test probes in contact with the bond pads and providing a vibrational movement to the biasing element such that the test probes move relative to the bond pads and such that the test probes remove an electrically non-conductive material on the surface of the bond pads to establish an electrical connection between the test probes and the bond pads.

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patent: 5436571 (1995-07-01), Karasawa
patent: 5773987 (1998-06-01), Montoya

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