Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2011-08-16
2011-08-16
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C372S025000, C438S458000
Reexamination Certificate
active
07998838
ABSTRACT:
A series of laser pulses in a pulse train, each pulse with a predetermined temporal power shape, scribes a line in a thin film of material on a substrate. The predetermined temporal pulse shape has a fast risetime and fast falltime and a pulse length between 10% power points of less than 10 ns. Scribing a line in the thin film is achieved by placing the series of laser pulse spots on the line to be scribed such that there is some overlapping area between adjacent laser pulse spots along the line. The use of a series of laser pulses with the predetermined pulse shape to scribe a line in the thin film results in a better quality and cleaner scribing process compared to that achieved with a conventional pulse shape.
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Dunsky Corey
Murison Richard
Panarello Tullio
Rekow Matthew
ESI-PyroPhotonics Lasers, Inc.
Kilpatrick Townsend & Stockton LLP
Le Thao P.
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