Method and apparatus for screen printing solder paste onto a sub

Details Method and apparatus for screen printing solder paste onto a sub Method and apparatus for screen printing solder paste onto a sub

1986-03-24

1987-07-07

Lawrence, Evan K.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

118504, 156252, 427 96, 427282, B32B 3112, B05C 1706, B05D 512

Patent

active

046785310

ABSTRACT:
A printing screen for screen printing fabrication substances such as solder paste has an aperture formed therein so that the screen may be placed on a substrate surface with a pre-mounted device extending through the aperture. A metal cap is bonded to the screen over the pre-mounted device to protect the device against damage during a subsequent screen printing operation. Different elements may, therefore, be bonded to a substrate in completely independent steps without the need for fluxing operations in later bonding operations.

REFERENCES:
Balents, L. M., "A Metal Mask . . . Thereon", RCA TN No. 978, Sep. 1974, pp. 1-2.

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