Method and apparatus for scanning a semiconductor wafer

Details Method and apparatus for scanning a semiconductor wafer Method and apparatus for scanning a semiconductor wafer

2007-03-20

2007-03-20

Stafira, Michael P. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237200

Reexamination Certificate

active

10774520

ABSTRACT:
The invention is based on a method and an apparatus for scanning a semiconductor wafer (1), on-the-fly images of regions on the wafer being acquired using a camera (3). Upon a scan line changeover, a continuously curved displacement track is generated by at least partial superimposition of the relative motions between the wafer (1) and camera (3) in the direction of the scan lines and perpendicular thereto. As a result, time is saved and wafer throughput is increased.

REFERENCES:
patent: 6650409 (2003-11-01), Noguchi et al.
patent: 2003/0092267 (2003-05-01), Kian et al.
patent: 2005/0214956 (2005-09-01), Li et al.
patent: 2005/0232362 (2005-10-01), Lee
patent: 2005/0253093 (2005-11-01), Gorski et al.
patent: 2005/0254698 (2005-11-01), Young et al.

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