Method and apparatus for SAW device passivation

Details Method and apparatus for SAW device passivation Method and apparatus for SAW device passivation

1991-09-10

1993-06-01

Chaudhuri, Olik

Metal working

Barrier layer or semiconductor device making

310313R, 310313B, H01L 4108

Patent

active

052155463

ABSTRACT:
A passivation layer of dielectric material disposed on the top surface of the SAW device prevents the metallized transducer pattern on the piezoelectric substrate from being exposed to chemical attack. This layer also provides for improved metal acousto-migration resistance through the well-known mechanism of grain boundary pinning. The piezoelectric SAW device substrate includes a dielectric layer which is disposed along the surface over the transducer metallization. The piezoelectric substrate includes metallized regions on top of the dielectric layer which is disposed over the substrate surface and the SAW transducers thereon. These metallized regions form capacitors to the transducer busses and capacitively couple electrical input and output signals to the transducers from external electronic apparatus.

REFERENCES:
patent: 4270105 (1981-05-01), Parker et al.
patent: 4354130 (1982-10-01), Ono et al.
patent: 4401956 (1983-08-01), Joshi
patent: 4516049 (1985-05-01), Mikoshiba et al.
patent: 4567393 (1986-01-01), Asai et al.
patent: 4617487 (1986-10-01), Sone et al.
patent: 4952832 (1990-08-01), Imai et al.

Affiliated with

Also associated with

Rating

Method and apparatus for SAW device passivation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for SAW device passivation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for SAW device passivation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1811429