Method and apparatus for routing a differential pair on a...

Details Method and apparatus for routing a differential pair on a... Method and apparatus for routing a differential pair on a...

2005-03-25

2008-05-20

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S759000, C361S802000, C361S756000

Reexamination Certificate

active

07375979

ABSTRACT:
A differential pair (200) is provided by routing a printed circuit board (202) having high density interconnect (HDI) substrate (204) with first and second metal layers (212, 218) such that a first runner (206) forms a zigzag pattern using the two metal layers while a second runner (208) forms a second zigzag pattern on the same two metal layers. The first and second zigzag patterns overlap so as to provide orthogonal signal flow.

REFERENCES:
patent: 3757028 (1973-09-01), Schlessel
patent: 3761842 (1973-09-01), Gandrud
patent: 5027088 (1991-06-01), Shimizu et al.
patent: 5039824 (1991-08-01), Takashima et al.
patent: 5430247 (1995-07-01), Bockelman
patent: 5618185 (1997-04-01), Aekins
patent: 6023200 (2000-02-01), Rhee
patent: 6816025 (2004-11-01), Nguyen

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