Method and apparatus for rounding the edges of semiconductive wa

Abrasive tool making process – material – or composition – Impregnating or coating an abrasive tool

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51103R, 51104, 51318, B24B 906

Patent

active

047182024

ABSTRACT:
In an apparatus for rounding the edges of semiconductive wafers, the wafers are loaded onto two parallel counter rotating screws one having a right hand thread and the other having a left hand thread. The grooves of respective ones of said screw engage the edges of the semiconductive wafer to be rounded. The grooves of the respective screws are of rounded cross-section and an abrasive slurry is introduced into the grooves to facilitate abrading of the edges of the wafers. A pressure roller engages the edges of the wafers and forces the wafers into the grooves to further facilitate rounding of the edges. Due to the action of the screws, the wafers, as they are being rounded are caused to traverse the length of the screws to provide a continuous processing of the wafers.

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patent: 3186134 (1965-06-01), Bonin
patent: 3507382 (1970-04-01), Wells
patent: 3791508 (1974-02-01), Osborne et al.

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