Method and apparatus for RF sealing of thermoplastic layers

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156273, 156289, 156380, 156498, 156515, 1565831, 219 1053, 219 1081, B29C 2704

Patent

active

042683386

ABSTRACT:
Two or more layers of nonpolar thermoplastic film are bonded together by application of an RF current. The layers of thermoplastic film are pressed against a thin electrode plate, which lies atop a thin sheet of dielectric material supported on a conductive electrode die having a face or configuration to define the shape of the seal to be formed between the layers. RF current is applied to the electrode plate and to the electrode die, generating localized heat in the portions of the dielectric sheet overlying the die until the thermoplastic material has softened sufficiently to form a seal. A release agent, such as a sheet of polytetrafluoroethylene, can be provided on one surface of the electrode plate to prevent the thermoplastic material from sticking to the electrode plate.

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