Liquid purification or separation – Constituent mixture variation responsive
Reexamination Certificate
2006-05-30
2006-05-30
Popovics, Robert James (Department: 1724)
Liquid purification or separation
Constituent mixture variation responsive
C210S096200, C210S097000, C210S103000, C210S108000, C210S167050, C210S171000, C210S194000, C210S087000, C210S639000, C210S651000, C210S739000, C210S740000, C210S742000, C210S743000, C241S039000, C241S068000, C241S097000, C241S098000, C241S285100, C451S060000, C451S447000
Reexamination Certificate
active
07052599
ABSTRACT:
An apparatus and method recycles the abrasive fluid or slurry effluent used in the polishing step in the manufacture of semiconductors. Agglomerations of abrasive grains built up in the slurry effluent are crushed using a mill, ultrasonic oscillation, or pressurized circulation. The slurry effluent is then regenerated and reused.
REFERENCES:
patent: 3802916 (1974-04-01), Jackson
patent: 3865629 (1975-02-01), Dankoff et al.
patent: 3905898 (1975-09-01), Jackson
patent: 4523988 (1985-06-01), Hedrick, II
patent: 4920704 (1990-05-01), Caserta et al.
patent: 5043071 (1991-08-01), Anselme et al.
patent: 5578222 (1996-11-01), Trischuk et al.
patent: 5647989 (1997-07-01), Hayashi et al.
patent: 5657876 (1997-08-01), Drenter et al.
patent: 5664990 (1997-09-01), Adams et al.
patent: 5755614 (1998-05-01), Adams et al.
patent: 5772900 (1998-06-01), Yorita et al.
patent: 5791970 (1998-08-01), Yueh
patent: 5799643 (1998-09-01), Miyata et al.
patent: 5830369 (1998-11-01), Toyama
patent: 5846398 (1998-12-01), Carpio
patent: 5895315 (1999-04-01), Pinder, Jr.
patent: 5928492 (1999-07-01), Corlett et al.
patent: 5974868 (1999-11-01), Decain et al.
patent: 6001265 (1999-12-01), Toyama et al.
patent: 6010010 (2000-01-01), Heinle et al.
patent: 6015499 (2000-01-01), Hayden
patent: 6048256 (2000-04-01), Obeng et al.
patent: 6051139 (2000-04-01), Lin et al.
patent: 6077437 (2000-06-01), Hayashi et al.
patent: 6096185 (2000-08-01), Corlett et al.
patent: 6106714 (2000-08-01), Chiu et al.
patent: 6106728 (2000-08-01), Iida et al.
patent: 6113473 (2000-09-01), Costantini et al.
patent: 6126531 (2000-10-01), Iida et al.
patent: 6165048 (2000-12-01), Russ et al.
patent: 6183352 (2001-02-01), Kurisawa
patent: 6231628 (2001-05-01), Zavattari et al.
patent: 6241587 (2001-06-01), Drill et al.
patent: 6244929 (2001-06-01), Russ et al.
patent: 6260709 (2001-07-01), Leman et al.
patent: 6264843 (2001-07-01), Wiesner
patent: 6306020 (2001-10-01), Hed et al.
patent: 6355184 (2002-03-01), Crevasse et al.
patent: 6358125 (2002-03-01), Kawashima et al.
patent: 6362103 (2002-03-01), Watts
patent: 6372111 (2002-04-01), Watts
patent: 6379538 (2002-04-01), Corlett et al.
patent: 6402599 (2002-06-01), Crevasse et al.
patent: 6413151 (2002-07-01), Mizuno et al.
patent: 6436281 (2002-08-01), Hammer et al.
patent: 6482325 (2002-11-01), Corlett et al.
patent: 6527969 (2003-03-01), Tanoue et al.
patent: 6558238 (2003-05-01), Crevasse et al.
patent: 6585570 (2003-07-01), Kim et al.
patent: 6656359 (2003-12-01), Osuda et al.
patent: 6721628 (2004-04-01), Lai et al.
patent: 6722958 (2004-04-01), Matsumoto et al.
patent: 6732017 (2004-05-01), Pham et al.
patent: 6733363 (2004-05-01), Moore
patent: 6755718 (2004-06-01), Moore
patent: 6773332 (2004-08-01), Moore
patent: 6783429 (2004-08-01), Nicholes et al.
patent: 6790127 (2004-09-01), Tanoue et al.
patent: 6796703 (2004-09-01), Lemke
patent: 6821437 (2004-11-01), Eisner et al.
patent: 6840840 (2005-01-01), Moore
patent: 6866784 (2005-03-01), Chang et al.
patent: 2004/0069878 (2004-04-01), Osuda et al.
patent: 85111548 (1998-01-01), None
patent: 07-275732 (1995-10-01), None
patent: 08-003543 (1996-01-01), None
patent: 09-102475 (1997-04-01), None
patent: 09-504223 (1997-04-01), None
patent: 09-168971 (1997-06-01), None
patent: 09-239661 (1997-09-01), None
patent: 09-285967 (1997-11-01), None
patent: 10-296115 (1998-11-01), None
patent: 1998-063539 (1998-10-01), None
Taiwanese Office Action dated Oct. 9, 2000 with translation.
Office Action dated Feb. 19, 2002—no translation.
Korean Office Action dated Sep. 16, 2005.
Japanese Office Action dated May 17, 2005.
Fukuizumi Masataka
Matoba Toru
Osuda Hiroshi
Armstrong Kratz Quintos Hanson & Brooks, LLP
Fujitsu Limited
Popovics Robert James
LandOfFree
Method and apparatus for reuse of abrasive fluid used in the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for reuse of abrasive fluid used in the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for reuse of abrasive fluid used in the... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3632058