Method and apparatus for retaining a formed compression dosage u

Details Method and apparatus for retaining a formed compression dosage u Method and apparatus for retaining a formed compression dosage u

1995-05-09

1997-07-15

Theisen, Mary Lynn

Plastic and nonmetallic article shaping or treating: processes

Forming articles by uniting randomly associated particles

264123, 425344, 425345, 425352, 425353, B29C 4308

Patent

active

056480334

ABSTRACT:
A method and apparatus is provided for the formation of a tablet from tableting feedstock. An elongate die is provided which has a cavity defined by an inner wall. A pair of die punches are insertably positioned within the cavity. The die punches include opposed facing surfaces for supporting therebetween tableting feedstock. The die punches are relatively movable within the cavity to a tablet forming position to compress the feedstock into a tablet. The tablet forming positions defined by the facing die punch surfaces are spaced apart sufficient distance so as to maintain the formed tablet in contact with the inner wall of the cavity so as to retain the tablet within the cavity upon removal of the die punches.

REFERENCES:
patent: 2068619 (1937-01-01), Bailey
patent: 2214505 (1940-09-01), Magnenat
patent: 2582922 (1952-01-01), Crowley et al.
patent: 3332367 (1967-07-01), Sperry et al.
patent: 4376111 (1983-03-01), Tovey
patent: 4493822 (1985-01-01), Tovey
patent: 4880373 (1989-11-01), Balog et al.
patent: 4943227 (1990-07-01), Facchini
patent: 5378416 (1995-01-01), Kishi et al.

Affiliated with

Also associated with

Rating

Method and apparatus for retaining a formed compression dosage u does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for retaining a formed compression dosage u, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for retaining a formed compression dosage u will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1490596