Method and apparatus for replicating heat profile of...

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C219S386000, C219S391000, C219S412000, C219S482000, C219S483000, C219S488000, C373S135000

Reexamination Certificate

active

06642486

ABSTRACT:

BACKGROUND OF THE INVENTION
The present technique relates generally to heat treatment systems and, more particularly, to industrial finish curing systems. In specific, a system and method is provided for developing a heat treatment process for an industrial infrared oven using a model infrared oven and heat profile scaling factors.
Heat treatment processes are often used to alter the material characteristics of a structure or a surface material applied to the structure. For example, finish coatings, such as paint, are often applied to a product and subsequently cured via radiative-heating ovens. Industrial radiative-heating ovens are typically large, stationary, and intended for actual production lines, such as for curing paint applied to an automobile. In order to develop a heat treatment process, the actual industrial oven is typically used to test the effects of different heating times, levels, and so forth. Unfortunately, process development using the actual industrial oven is time-consuming, expensive, and it results in downtime from actual production.
Accordingly, a technique is needed for replicating the heat profile of the industrial radiative-heating oven in a model radiative-heating oven.
SUMMARY OF THE INVENTION
A system and method for developing a heat treatment process using a model radiative-heating oven, which repeatably and accurately simulates an industrial heat treatment system. In order to simulate the industrial heat treatment system, the model radiative-heating oven uses a variety of scaling factors, such as heating density parameters. The model radiative-heating oven also may have a quickly openable and closable object carrier, which facilitates a timely start and end of a desired heat treatment process. An oven temperature stabilizer also may be provided for thermally stabilizing the model radiative-heating oven prior to the desired heat treatment process. The present technique also may utilize a variety of heat profile controls, such as time, temperature, and power levels, to provide the desired heat profile in the heat treatment process.


REFERENCES:
patent: 5003160 (1991-03-01), Matsuo et al.
patent: 6207936 (2001-03-01), de Waard et al.
patent: 6462311 (2002-10-01), Emiglio
CN 1334048 patent abstract, Feb. 6, 2002.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for replicating heat profile of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for replicating heat profile of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for replicating heat profile of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3114344

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.