Method and apparatus for replenishing an electroplating bath wit

Details Method and apparatus for replenishing an electroplating bath wit Method and apparatus for replenishing an electroplating bath wit

1981-01-07

1982-04-13

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204235, 204236, C25D 500, C25D 2102, C25D 2106, C25D 2118

Patent

active

043246230

ABSTRACT:
For replenishing a plating bath with copper or other metal to be electrodeposited with the use of an insoluble anode, scrap metal such as copper wires is received in a makeup tank, into which are passed the gases generated within the plating tank with the progress of electroplating operation. The plating solution in the plating tank is also directed into the makeup tank and sprayed on the scrap copper wires, thereby dissolving same. The dissolved copper is then filtered, heated, and introduced into the plating tank.

REFERENCES:
patent: 1527305 (1925-02-01), Hutchins
patent: 1601693 (1926-09-01), Merritt
patent: 2072811 (1937-03-01), Ellsworth
patent: 2449422 (1948-09-01), Smith
patent: 4053370 (1977-10-01), Yamashita
patent: 4119516 (1978-10-01), Yamaguchi

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