Method and apparatus for removing unwanted substance from...

Details Method and apparatus for removing unwanted substance from... Method and apparatus for removing unwanted substance from...

2006-06-13

2006-06-13

Lindsay, Jr., Walter L. (Department: 2812)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S510000

Reexamination Certificate

active

07060154

ABSTRACT:
An apparatus for removing an unwanted substance from a semiconductor wafer, according to this invention, applies a peeling tape T to a protective tape P on the surface of the semiconductor wafer W. An edge member28is placed in contact with the surface of the peeling tape T and run along the protective tape P. The peeling tape T is peeled as being folded back by a large angle of 90 degrees or more at the tip of edge member28. The protective tape P is peeled and removed along with the peeling tape T from the surface of the wafer. As a result, the unwanted substance is removed with high precision without breaking the wafer W.

REFERENCES:
patent: 4631110 (1986-12-01), Tsumura et al.
patent: 4775438 (1988-10-01), Funakoshi et al.
patent: 5891298 (1999-04-01), Kuroda et al.
patent: 5911850 (1999-06-01), Zung
patent: 6100166 (2000-08-01), Sakaguchi et al.
patent: 6159827 (2000-12-01), Kataoka et al.
patent: 6238515 (2001-05-01), Tsujimoto et al.
patent: 6534382 (2003-03-01), Sakaguchi et al.
patent: 2005/0081988 (2005-04-01), Yamamoto
patent: 0 901 154 (1999-03-01), None
patent: 1 128 415 (2001-08-01), None
patent: 11-045934 (1999-02-01), None
patent: 2000-335816 (2000-05-01), None
International Search Report of PCT/JP01/06556 mailed May 16, 2002.

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