Method and apparatus for removing solder mounted electronic comp

Details Method and apparatus for removing solder mounted electronic comp Method and apparatus for removing solder mounted electronic comp

1989-09-20

1990-06-19

Godici, Nicholas P.

Metal fusion bonding

Process

With disassembling of bonded joint

228264, 228 19, B23K 1018

Patent

active

049345826

ABSTRACT:
A method and apparatus are described for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0.020 inches.

REFERENCES:
patent: 3627191 (1971-12-01), Hood, Jr.
patent: 3751799 (1973-08-01), Reynolds
patent: 3973714 (1976-08-01), Lesyk et al.
patent: 4164606 (1979-08-01), Spirig
patent: 4436242 (1984-03-01), Shisler et al.
patent: 4614858 (1986-09-01), Vial
patent: 4746050 (1988-05-01), Brown
patent: 4813589 (1989-03-01), Palmer et al.
IBM Technical Disclosure Bulletin, "Solder Wick", vol. 13, No. 2, p. 445, Jul. 1970.
IBM Technical Disclosure Bulletin, Desoldering Unit, vol. 21, No. 11, p. 4482, Apr. 1979.

Affiliated with

Also associated with

Rating

Method and apparatus for removing solder mounted electronic comp does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for removing solder mounted electronic comp, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for removing solder mounted electronic comp will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2254883