Drying and gas or vapor contact with solids – Process – Mechanical liquid removal
Reexamination Certificate
2005-09-12
2008-08-26
Rinehart, Kenneth B (Department: 3749)
Drying and gas or vapor contact with solids
Process
Mechanical liquid removal
C034S092000, C015S300100
Reexamination Certificate
active
07415780
ABSTRACT:
A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom. The vacuum application member includes, for example, vacuum slots configured for disposition in proximity to the substrate surfaces and/or at least partially porous tubes configured for moving contact with the substrate surfaces. The apparatus can process one substrate at a time or remove liquid from multiple substrates simultaneously.
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Dye Mark
Miranda Henry R.
P.C.T. Systems, Inc.
Rinehart Kenneth B
Townsend and Townsend / and Crew LLP
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