Drying and gas or vapor contact with solids – Process – With fluid current conveying or suspension of treated material
Reexamination Certificate
2005-11-01
2005-11-01
Rinehart, Kenneth (Department: 3749)
Drying and gas or vapor contact with solids
Process
With fluid current conveying or suspension of treated material
C034S399000, C034S453000, C034S406000
Reexamination Certificate
active
06959503
ABSTRACT:
A cost effective and environmentally sound method for quickly removing liquid from surfaces of a substrate under manufacture without leaving behind substantial residue (e.g., silicon elements from the substrate, commonly known in the field as “water marks”). The process includes first providing a substrate (e.g., a semiconductor wafer, glass flat panel, or disc media), which has undergone one or more liquid-based processes (e.g., cleaning, scrubbing, rinsing, etc.). An upper surface and a lower surface of the substrate are then subjected to vacuum suction, thereby removing liquid thereon. An apparatus for removing liquid from surfaces of a substrate is also provided. The apparatus includes a plurality of vacuum application members configured for applying vacuum suction to surfaces of a substrate, thereby removing liquid therefrom. The vacuum application member includes, for example, vacuum slots configured for disposition in proximity to the substrate surfaces and/or at least partially porous tubes configured for moving contact with the substrate surfaces. The apparatus can process one substrate at a time or remove liquid from multiple substrates simultaneously.
REFERENCES:
patent: 3056213 (1962-10-01), Kellogg
patent: 3060594 (1962-10-01), Meier-Windhorst
patent: 3430352 (1969-03-01), Hans
patent: 3503136 (1970-03-01), Fleissner
patent: 3968571 (1976-07-01), Oschatz et al.
patent: 5301701 (1994-04-01), Nafziger
patent: 5581906 (1996-12-01), Ensign et al.
patent: 5873014 (1999-02-01), Knapp et al.
patent: 5953823 (1999-09-01), Rosynsky et al.
patent: 5966836 (1999-10-01), Valdez, III et al.
patent: 6286524 (2001-09-01), Okuchi et al.
patent: 6434856 (2002-08-01), Ensign et al.
Dye Mark
Miranda Henry R.
P.C.T. Systems, Inc.
Rinehart Kenneth
Townsend and Townsend / and Crew LLP
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