Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-09-25
2007-09-25
Fahmy, Wael (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S106000, C438S123000, C438S124000, C438S125000, C438S126000, C257S675000, C257S706000, C257S796000
Reexamination Certificate
active
09639917
ABSTRACT:
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a microelectronic substrate by directing a source of laser radiation toward the encapsulating material. The method can further include exposing a surface of the microelectronic substrate, for example, to enhance a rate at which heat is transferred away from the microelectronic substrate. Alternatively, the encapsulating material can be removed to form heat transfer structures, such as pins or ribs, also to enhance a rate at which heat is transferred away from the microelectronic substrate. In still another embodiment, a portion of the encapsulating material or a support member to which the substrate is attached can be removed to define interlocking features that allow one microelectronic substrate package to be stacked on another and to resist relative movement between the two packages.
REFERENCES:
patent: 4560580 (1985-12-01), Needham et al.
patent: 5041902 (1991-08-01), McShane
patent: 5138434 (1992-08-01), Wood et al.
patent: 5254500 (1993-10-01), AuYeung
patent: 5296740 (1994-03-01), Sono et al.
patent: 5344795 (1994-09-01), Hashemi et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5394010 (1995-02-01), Tazawa et al.
patent: 5406117 (1995-04-01), Dlugokecki et al.
patent: 5438216 (1995-08-01), Juskey et al.
patent: 5483098 (1996-01-01), Joiner, Jr.
patent: 5536685 (1996-07-01), Burward-Hoy
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5604376 (1997-02-01), Hamburgen et al.
patent: 5622873 (1997-04-01), Kim et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5696033 (1997-12-01), Kinsman
patent: 5723900 (1998-03-01), Kojima et al.
patent: 5739585 (1998-04-01), Akram et al.
patent: 5754408 (1998-05-01), Derouiche
patent: D394844 (1998-06-01), Farnworth et al.
patent: 5777391 (1998-07-01), Nakamura et al.
patent: 5790381 (1998-08-01), Derouiche et al.
patent: D402638 (1998-12-01), Farnworth et al.
patent: 5851845 (1998-12-01), Wood et al.
patent: 5866953 (1999-02-01), Akram et al.
patent: 5891753 (1999-04-01), Akram
patent: 5893726 (1999-04-01), Farnworth et al.
patent: 5898224 (1999-04-01), Akram
patent: 5925934 (1999-07-01), Lim
patent: 5933713 (1999-08-01), Farnworth
patent: 5938956 (1999-08-01), Hembree et al.
patent: 5952714 (1999-09-01), Sano et al.
patent: 5958100 (1999-09-01), Farnworth et al.
patent: 5962810 (1999-10-01), Glenn
patent: 5986209 (1999-11-01), Tandy
patent: 5989941 (1999-11-01), Wensel
patent: 5990566 (1999-11-01), Farnworth et al.
patent: 5994784 (1999-11-01), Ahmad
patent: RE36469 (1999-12-01), Wood et al.
patent: 6008070 (1999-12-01), Farnworth
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6028365 (2000-02-01), Akram et al.
patent: 6046496 (2000-04-01), Corisis et al.
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6049125 (2000-04-01), Brooks et al.
patent: 6049129 (2000-04-01), Yew et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6075288 (2000-06-01), Akram
patent: 6093029 (2000-07-01), Kwon et al.
patent: 6093969 (2000-07-01), Lin
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6103547 (2000-08-01), Corisis et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6107680 (2000-08-01), Hodges
patent: 6117382 (2000-09-01), Thummel
patent: 6117797 (2000-09-01), Hembree
patent: 6122171 (2000-09-01), Akram et al.
patent: 6124634 (2000-09-01), Akram et al.
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6150717 (2000-11-01), Wood et al.
patent: 6153924 (2000-11-01), Kinsman
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6159770 (2000-12-01), Tetaka et al.
patent: 6163956 (2000-12-01), Corisis
patent: 6172419 (2001-01-01), Kinsman
patent: 6175159 (2001-01-01), Sasaki
patent: 6177726 (2001-01-01), Manteghi
patent: 6184465 (2001-02-01), Corisis
patent: 6198171 (2001-03-01), Huang et al.
patent: 6198172 (2001-03-01), King et al.
patent: 6208519 (2001-03-01), Jiang et al.
patent: 6210992 (2001-04-01), Tandy et al.
patent: 6215175 (2001-04-01), Kinsman
patent: 6218731 (2001-04-01), Huang et al.
patent: 6228548 (2001-05-01), King et al.
patent: 6228676 (2001-05-01), Glenn et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6246108 (2001-06-01), Corisis et al.
patent: 6249433 (2001-06-01), Huang et al.
patent: 6252308 (2001-06-01), Akram et al.
patent: 6252772 (2001-06-01), Allen
patent: 6258624 (2001-07-01), Corisis
patent: 6259153 (2001-07-01), Corisis
patent: 6277671 (2001-08-01), Tripard
patent: 6284571 (2001-09-01), Corisis et al.
patent: 6291894 (2001-09-01), Farnworth et al.
patent: 6294839 (2001-09-01), Mess et al.
patent: 6303981 (2001-10-01), Moden
patent: 6303985 (2001-10-01), Larson et al.
patent: 6309943 (2001-10-01), Glenn et al.
patent: 6310390 (2001-10-01), Moden
patent: 6314639 (2001-11-01), Corisis
patent: 6316285 (2001-11-01), Jiang et al.
patent: 6326242 (2001-12-01), Brooks et al.
patent: 6326244 (2001-12-01), Brooks et al.
patent: 6326687 (2001-12-01), Corisis
patent: 6326697 (2001-12-01), Farnworth
patent: 6326698 (2001-12-01), Akram
patent: 6326700 (2001-12-01), Bai et al.
patent: 6329220 (2001-12-01), Bolken et al.
patent: 6331221 (2001-12-01), Cobbley
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6332766 (2001-12-01), Thummel
patent: 6335208 (2002-01-01), Lowry
patent: 6335571 (2002-01-01), Capote et al.
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6369455 (2002-04-01), Ho et al.
patent: 6379988 (2002-04-01), Peterson et al.
patent: 6395584 (2002-05-01), Hsu et al.
patent: 6414385 (2002-07-01), Huang et al.
patent: 6420790 (2002-07-01), Koizumi et al.
patent: 6424031 (2002-07-01), Glenn
patent: 6432840 (2002-08-01), Hembree
patent: 6433419 (2002-08-01), Khandros et al.
patent: 6451709 (2002-09-01), Hembree
patent: 6486562 (2002-11-01), Kato
patent: 6518659 (2003-02-01), Glenn
patent: 6534861 (2003-03-01), Castro
patent: 6544814 (2003-04-01), Yasunaga et al.
patent: 6667544 (2003-12-01), Glenn
patent: 6774473 (2004-08-01), Shen
patent: 6778404 (2004-08-01), Bolken et al.
patent: 2001/0013639 (2001-08-01), Abe
patent: 2002/0060369 (2002-05-01), Akram
patent: 2002/0173070 (2002-11-01), Bolken et al.
patent: 2002/0180035 (2002-12-01), Huang et al.
patent: 2003/0080440 (2003-05-01), Miks et al.
patent: 2005/0148160 (2005-07-01), Farnworth et al.
patent: 2 673 040 (1992-08-01), None
patent: 357211259 (1982-12-01), None
patent: 358100447 (1983-06-01), None
patent: 361114563 (1986-06-01), None
patent: 403208363 (1991-09-01), None
patent: 5-047963 (1993-02-01), None
patent: 406177268 (1994-06-01), None
patent: 8-213520 (1996-08-01), None
Fahmy Wael
Micro)n Technology, Inc.
Mitchell James M
Perkins Coie LLP
LandOfFree
Method and apparatus for removing encapsulating material... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for removing encapsulating material..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for removing encapsulating material... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3803081